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Power Stencils

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The primary purpose of using SMT stencils is to facilitate placing of a component onto aboard after a coat of solder paste is applied on it. Power stencils help a great deal in cutting down labor costs and lead time by reducing the manual placement of components and are hence considered a boon for mass production of the same PCB.SMT stencils come in two different formats – framed and frameless. Although the framed stencils are more suited for high volume print circuit boards the frameless foils being easily replaceable are preferable for a high mix environment where various PCBs are being manufactured on the very same line. The frameless ones have an added advantage that they need not be permanently glued onto the frame.

The frameless systems are somewhat expensive but the lower replacement costs for the foils and less storage space required in their case make them a worthwhile purchase.

Handling Data :

  • Gerber file (RS 274X)
  • GDS II, DXF
  • Framed Stencils
  • Frameless Stencils
Framed Stencils

PCB POWER introduce framed stencils for the SMT ,semiconductor and solar industries. Combined with our patented F2 polishing technology this ensures relatively no burrs on the hole walls and a mirror like finish that helps paste flow evenly on the surface. we guarantee aperture size accuracy of +‑5um and positioning accuracy of +‑ 10um. For boards with fine pitch components we recommend also combining F3 Nano Coating for better throughput.

Advantages :

  • Use Japanese garde fine grain sheet
  • DFM study for all jobs
  • Can be combine with F2 polishing & F3 Nano coating
  • Aperture size accuracy of +- 5um and positioning accuracy +-10um

Framed SMT Stencils Specs :

Stencil MaterialSUS-3O4
Opening precision±5μm Within ±5μm [Stencil thickness 50μm, round hole
With Frame Stencils : Available Sizes(mm)737 X 737, 584 X 584, 559 X 559, 508 X 508, 650 X 550
Available thickness (mil)4, 5, 6, 7, 8
Pitch dimensional precision+2Oμm Within ±20μm [per pitch 2 0 mm]
Min hole diameterΦ120μm [for stencil thickness 100mm]
Frameless Stencils

Frameless SMT Stencils also referred to as foils are laser cut solder paste stencils designed to work with stencil tensioning systems known as reusable stencil frames. This type of stencil does not need to be permanently glued in a frame. Frameless stencils are significantly less expensive than framed stencils and provide money-saving storage while still delivering superior quality and performance.

Advantages :

  • Compatible with all printers
  • Comes with built in measuring gauge for recording tension

Frameless SMT Stencils Specs :

Stencil MaterialSUS-3O4
Opening precision±5μm Within ±5μm [Stencil thickness 50μm, round hole
Available Sizes (mm)100mm to 400mm
Available thickness (mil)4, 5, 6, 7, 8
Pitch dimensional precision+2Oμm Within ±20μm [per pitch 2 0 mm]
Min hole diameterΦ120μm [for stencil thickness 100mm]

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