PCB POWER offers the most suitable assembly set up for its small quantity end users, D houses, students hobbyists; a solution for assembly of proto small quantity PCBs with SMD.
Our SMD Reflow Oven Stencil Printer and Camera Assisted Pick and Place Manual Machine have some remarkable features:
SMD stencil printer uses a simple pin-registration system for fast and precise set-up with low-cost frameless stainless-steel stencils.
Rigid precision-engineered construction ensures excellent repeatability for small batch printing.
After printing the stencil is separated vertically from the board.It is critical to achieve good paste deposition for fine footprints.
SOLDER TYPES | LEADED AND ULEADED |
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Maximum stencil size | 390 x 290 mm |
Maximum PCB size | 350 x 250 mm |
Dimensions | 670 (d) x 470 (w) x 190 (h) mm |
Weight | 19 kg |
Camera-assisted manual pick and place device power-placer is a camera-assisted manual pick and place device designed and priced for prototype and small series assembly.
Power-placer speeds up component placement and in combination with our other soldering-equipment gives significant savings in time and costs.
Power-placer’s robust construction ensures long-term accuracy and repeatability. The machine is fast to set-up with 23 adjustable feeders included for component tapes and sticks. The combination of clear imaging from the high-definition camera and ergonomic design enhances productivity and minimizes operator fatigue. Two special placement modes boost speed and accuracy. The Array mode provides a fast solution for placing a row of components. The Copy-paste mode uses a standard steel stencil to accurately locate BGAs, FPGAs and other complex components which are difficult to place by eye alone.
Power-placer Specifications:
SMD reflow oven gives an even temperature across the board under total user control throughout the soldering process. The reflow-pilot software allows the user to define and store an unlimited number of temperature and time profiles and to monitor the exact process for each board. Separate sensors can be used to measure and display the temperature profile on the actual PCB – order -reflow-oven now.
SOLDER TYPES | LEADED AND ULEADED |
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Maximum PCB size | 350 x 250 mm |
Heating method | Quartz IR and ducted forced hot-air |
Temperature range | Up to 288°C |
Temperature control method | +/- 20°C boost function |
Programming | Windows-compatible software |
PC link | USB port |
Electrical requirements | 230V AC – 50Hz |
Power requirements | ca. 3000W |
Dimensions | 520 (d) x 620 (w) x 245 (h) mm |
Weight | 29 kg |