Technical Capabilities
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PCB Technical Capabilities

Technical Capabilities (All values are in mm)

Specification Value
Max. no. of Layers 24
Max. Board Size (L x W) 430 x 585 (For SS & DS)
415 x 565 (For Multi layers)
Max. Board Thickness 3.20
Min. Finished Board Thickness 0.20 (No HAL / Masking)

Base Materials

Specification Value
Base Material FR4
Inner Layer Copper Cladding
* Max. Cu Wt. For Planes (Oz.) 2
* Max. Cu Wt. For Signals (Oz.) 2
* Min. Cu Wt. (Oz.) 0.5
c) Outer Layer Copper Clading
* Max Cu Wt. (Oz.) 3
* Min Cu Wt. (Oz.) 0.5

Circuit Layers (All values are in mm)

Specification Value
For Start Copper Thickness of 0.5 Oz.
For Outer Layer Min Track Width 0.09
For Outer Layer Min Spacing 0.09
For Inner Layer Min Track Width 0.125
For Inner Layer Min. Spacing 0.125
For Start Copper Thickness of 1.0 Oz.
Min Track Width 0.15
Min. Spacing 0.15
For Start Copper Thickness of 2.0 Oz.
Min Track Width 0.175
Min. Spacing 0.20

Drilling (All values are in mm)

Specification Value
Min. Finished via Hole Size 0.10
Min. Finished via Pad Size
Outer Layers 0.40
Inner Layers 0.45
Min. Annular Ring 0.10
Drill to Drill Clearance 0.15
Min. Slot Size For PTH Slots (Tool size) 0.50
Blind & Buried vias Manufacturable Yes
Drill to Track Clearance For Inner Layers (upto 6 layer) 0.25
Drill to Track Clearance for Inner Layers (>6 layer) 0.35
Min. Drill Size For Plated Holes on Board Edge 0.80
Min. Drill to Drill Clearance For Plated Holes on Board Edge 0.80

Surface Finish

Specification Value
HASL (Lead free & PB/Sn both) Yes
Electrolytic Gold Yes
Electroless Nickle / Gold Yes
Immersion Tin Yes

Layer construction Impedance Design (All values are in mm)

Specification Value
Min. Core Thickness 0.15
Min. Possible Dielectric Thickness 0.15
Controlled Impedance Measurement Yes

Solder Mask (All values are in mm)

Specification Value
Mask Opening
Green & Blue Masking 0.06
Min. Soldermask Web Width Between Pads 0.08
Mask Opening
Other than Green & Blue Masking 0.120
Min. Soldermask Web Width Between Pads 0.120
SM to Trace Clearance 0.10
Via Fill Max Drill Size 0.40

Legend (All values are in mm)

Specification Value
Legend Line Width 0.15 to 0.20
Min. Character Height 1.00

Scoring

Specification Value
Angle For v-cut 30 degree
Jump Scoring Yes

Routing (All values are in mm)

Specification Value
Min. Router Size 0.80

Copper Clearance from PCB Edge (All values are in mm)

Specification Value
For Routing 0.25
For Scoring 0.45
For Inner layer 0.4

Carbon (All values are in mm)

Specification Value
Min. Line Width 0.30
Min. Carbon – Carbon Spacing 0.25

Peelable (All values are in mm)

Specification Value
Minimum Width of Any Peel-off Element 0.50
Maximum Coverable Hole ENDSIZE 6.00
Minimum Overlap on Copper Pattern 0.254
Minimum Clearance to Free Copper 0.254
Minimum Distance From PCB Outline 0.50

Drill Tolerances (All values are in mm)

PTH Hole Size PTH Tolerance NPTH Hole Size NPTH Tolerance
0.50-3.50 +/- 0.10 3 +/- 0.10
>3.50 +/- 0.15 >3 +/- 0.15

Other Tolerances

PCB Size PCB Thickness Trace Width / Spacing Copper Thickness Inside Hole Bow & twist tolerance
+/- 0.20 mm +/- 20% (Up to 0.8 mm thickness) +/- 0.20 % >= 0.0002 +/- 1%
+/- 10% (Above 1.0 mm thickness)

Available Finishes

RoHS Compliances finishes Non-RoHS Finish
Lead Free HAL HAL(sn PB)
Immersion Tin -
Electroless Nickel Immerssion Gold (0.075-0.1 um AU + 3-5 um Ni) -

Legend Colours

Color Value
White Yes
Black Yes
Yellow Yes

Solder Mask Colours

Color Value
Green Yes
Black Yes
White Yes
Blue Yes
Red Yes

Technologies

Color Value
Impedance Control Yes
Blind / Buried Vias Yes
Carbon Printing Yes
Hard Gold Tabs Yes
Peelable Solder Mask Yes
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