Sr | Specification | Value | |
---|---|---|---|
a) | Max. no. of layers | 24 | |
b) | Max. board size (L x W) in mm. | 415 x 565 | |
c) | Max. board thickness (in mm.) | 3.20 | |
d) | Min. finished board thickness (in mm.) | 0.40 (No HAL) |
Sr | Specification | Value | |
---|---|---|---|
a) | Max. no. of layers | 24 | |
b) | Max. board size (L x W) in mm. | 415 x 565 | |
c) | Max. board thickness (in mm.) | 3.20 | |
d) | Min. finished board thickness (in mm.) | 0.40 (No HAL) |
Sr | Specification | Value | |
---|---|---|---|
a) | Base Material | FR4 | |
b) | Inner layer Copper cladding | ||
* Max. Cu Wt. For Planes (Oz.) | 2 | ||
* Max. Cu Wt. For Signals (Oz.) | 2 | ||
* Min. Cu Wt. (Oz.) | 0.5 | ||
c) | Outer layer Copper cladding | ||
*Max Cu Wt. (Oz.) | 3 | ||
*Min Cu Wt. (Oz.) | 0.5 |
Sr | Specification | Value | ||
---|---|---|---|---|
For Start copper thickness of 0.5 Oz. | For Outer Layer | Min track width | 0.10 | |
For Outer Layer | Min. Spacing | 0.10 | ||
For Inner Layer | Min track width | 0.125 | ||
For Inner Layer | Min. Spacing | 0.125 | ||
For Start copper thickness of 1.0 Oz. | Min track width | 0.15 | ||
Min. Spacing | 0.15 | |||
For Start copper thickness of 2.0 Oz. | Min track width | 0.175 | ||
Min. Spacing | 0.20 |
Sr | Specification | Value | |
---|---|---|---|
a) | Min. finished via hole size | 0.10 | |
b) | Min. finished via pad size | 0.45 | |
c) | Min. annular ring | 0.10 | |
d) | Drill to drill clearance | 0.15 | |
e) | Min. slot size for PTH slots (Tool size) | 0.50 | |
f) | Blind & Buried vias manufacturable | YES | |
g) | Drill to track clearance for Inner layers (upto 6 layer) | 0.25 | |
Drill to track clearance for Inner layers (>6 layer) | 0.35 | ||
h) | Min. drill size for plated holes on board edge | 0.80 | |
i) | Min. drill to drill clearance for plated holes on board edge | 0.80 |
Sr | Specification | Value | |
---|---|---|---|
a) | HASL (Lead free & PB/Sn both) | YES | |
b) | Electrolytic Gold | YES | |
c) | Electroless Nickle / Gold | YES | |
d) | Immersion Silver | YES | |
e) | Immersion Tin | YES | |
f) | SMOBC with OSP | YES |
Sr | Specification | Value | |
---|---|---|---|
a) | Min. core thickness | 0.15 mm | |
b) | Min. possible dielectric thickness | 0.15 mm | |
c) | Controlled Impedance merasurement | YES |
Sr | Specification | Value | |
---|---|---|---|
a) | Mask opening | Green masking | 0.06 mm |
b) | Min. soldermask web width between pads | 0.08 mm | |
c) | Mask opening | Other than Green | 0.120 mm |
d) | Min. soldermask web width between pads | 0.120 mm | |
e) | SM to trace clearance | 0.10 mm | |
f) | Via fill max drill size | 0.40 mm |
Sr | Specification | Value | |
---|---|---|---|
a) | Legend line width | 0.15 mm to 0.20 mm | |
b) | Min. character height | 1.00 mm |
Sr | Specification | Value | |
---|---|---|---|
a) | Angle for v-cut | 30 degree | |
b) | Jump scoring | Yes |
Sr | Specification | Value | |
---|---|---|---|
a) | Min. router size | 0.80 mm |
Sr | Specification | Value | |
---|---|---|---|
a) | For routing | 0.25 mm | |
b) | For scoring | 0.45 mm | |
c) | For inner layer | 0.4 mm |
Sr | Specification | Value | |
---|---|---|---|
a) | Min. line width | 0.30 mm | |
b) | Min. carbon – carbon spacing | 0.25 mm |
Sr | Specification | Value | |
---|---|---|---|
a) | Minimum width of any Peel-off element | 0.50 mm | |
b) | Maximum coverable hole ENDSIZE | 6.00 mm | |
c) | Minimum overlap on copper pattern | 0.254 mm | |
d) | Minimum clearance to free copper | 0.254 mm | |
e) | Minimum distance from PCB outline | 0.50 mm |
PTH Hole Size | PTH Tolerance | NPTH Hole Size | NPTH Tolerance |
---|---|---|---|
0.50-3.50 mm | +/- 0.10 mm | <3 mm | +/- 0.10 mm |
>3.50 mm | +/- 0.15mm | >3 mm | +/- 0.15 mm |
PCB Size | +/- 0.20 mm |
PCB Thickness |
+/- 20% (Up to 0.8 mm thickness) +/- 10% (Above 1.0 mm thickness) |
Trace Width / Spacing | +/- 0.20 % |
Copper Thickness Inside Hole | >= 0.20 um |
Bow & twist tolerance | +/- 1% |
ROHS Compliances finishes :
Non-ROHS Finish :