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Technical Capabilities

PCB Technical Capabilities

Technical Capabilities (All values are in mm)

Specification	Value
Max. no. of Layers	24
Max. Board Size (L x W)	430 x 585 (For SS & DS) 415 x 565 (For Multi layers)
Max. Board Thickness	3.20
Min. Finished Board Thickness	0.20 (No HAL / Masking)

Base Materials

Specification	Value
Base Material	FR4
Inner Layer Copper Cladding
* Max. Cu Wt. For Planes (Oz.)	2
* Max. Cu Wt. For Signals (Oz.)	2
* Min. Cu Wt. (Oz.)	0.5
c)	Outer Layer Copper Clading
* Max Cu Wt. (Oz.)	3
* Min Cu Wt. (Oz.)	0.5

Circuit Layers (All values are in mm)

Specification			Value
For Start Copper Thickness of 0.5 Oz.
For Outer Layer	Min Track Width		0.09
For Outer Layer	Min Spacing		0.09
For Inner Layer	Min Track Width		0.125
For Inner Layer	Min. Spacing		0.125
For Start Copper Thickness of 1.0 Oz.
Min Track Width			0.15
Min. Spacing			0.15
For Start Copper Thickness of 2.0 Oz.
Min Track Width			0.175
Min. Spacing			0.20

Drilling (All values are in mm)

Specification	Value
Min. Finished via Hole Size	0.10
Min. Finished via Pad Size
Outer Layers	0.40
Inner Layers	0.45
Min. Annular Ring	0.10
Drill to Drill Clearance	0.15
Min. Slot Size For PTH Slots (Tool size)	0.50
Blind & Buried vias Manufacturable	Yes
Drill to Track Clearance For Inner Layers (upto 6 layer)	0.25
Drill to Track Clearance for Inner Layers (>6 layer)	0.35
Min. Drill Size For Plated Holes on Board Edge	0.80
Min. Drill to Drill Clearance For Plated Holes on Board Edge	0.80

Surface Finish

Specification	Value
HASL (Lead free & PB/Sn both)	Yes
Electrolytic Gold	Yes
Electroless Nickle / Gold	Yes
Immersion Tin	Yes

Layer construction Impedance Design (All values are in mm)

Specification	Value
Min. Core Thickness	0.15
Min. Possible Dielectric Thickness	0.15
Controlled Impedance Measurement	Yes

Solder Mask (All values are in mm)

Specification	Value
Mask Opening
Green Masking	0.06
Blue Masking	0.06
Min. Soldermask Web Width Between Pads	0.08
Mask Opening
Other than Green	0.120
Min. Soldermask Web Width Between Pads	0.120
SM to Trace Clearance	0.10
Via Fill Max Drill Size	0.40

Legend (All values are in mm)

Specification	Value
Legend Line Width	0.15 to 0.20
Min. Character Height	1.00

Scoring

Specification	Value
Angle For v-cut	30 degree
Jump Scoring	Yes

Routing (All values are in mm)

Specification	Value
Min. Router Size	0.80

Copper Clearance from PCB Edge (All values are in mm)

Specification	Value
For Routing	0.25
For Scoring	0.45
For Inner layer	0.4

Carbon (All values are in mm)

Specification	Value
Min. Line Width	0.30
Min. Carbon – Carbon Spacing	0.25

Peelable (All values are in mm)

Specification	Value
Minimum Width of Any Peel-off Element	0.50
Maximum Coverable Hole ENDSIZE	6.00
Minimum Overlap on Copper Pattern	0.254
Minimum Clearance to Free Copper	0.254
Minimum Distance From PCB Outline	0.50

Drill Tolerances (All values are in mm)

PTH Hole Size	PTH Tolerance	NPTH Hole Size	NPTH Tolerance
0.50-3.50	+/- 0.10	3	+/- 0.10
>3.50	+/- 0.15	>3	+/- 0.15

Other Tolerances

PCB Size	PCB Thickness	Trace Width / Spacing	Copper Thickness Inside Hole	Bow & twist tolerance
+/- 0.20 mm	+/- 20% (Up to 0.8 mm thickness)	+/- 0.20 %	>= 0.0002	+/- 1%
	+/- 10% (Above 1.0 mm thickness)

Available Finishes

RoHS Compliances finishes	Non-RoHS Finish
Lead Free HAL	HAL(sn PB)
Immersion Tin	-
Electroless Nickel Immerssion Gold (0.075-0.1 um AU + 3-5 um Ni)	-

Legend Colours

Color	Value
White	Yes
Black	Yes
Yellow	Yes

Solder Mask Colours

Color	Value
Green	Yes
Black	Yes
White	Yes
Blue	Yes
Red	Yes

Technologies

Color	Value
Impedance Control	Yes
Blind / Buried Vias	Yes
Carbon Printing	Yes
Hard Gold Tabs	Yes
Peelable Solder Mask	Yes