Technical Capabilities

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Sr	Specification		Value
a)	Max. no. of layers		24
b)	Max. board size (L x W) in mm.		415 x 565
c)	Max. board thickness (in mm.)		3.20
d)	Min. finished board thickness (in mm.)		0.40 (No HAL)

Sr	Specification		Value
a)	Base Material		FR4
b)	Inner layer Copper cladding
	* Max. Cu Wt. For Planes (Oz.)		2
	* Max. Cu Wt. For Signals (Oz.)		2
	* Min. Cu Wt. (Oz.)		0.5
c)	Outer layer Copper cladding
	*Max Cu Wt. (Oz.)		3
	*Min Cu Wt. (Oz.)		0.5

Sr	Specification			Value
	For Start copper thickness of 0.5 Oz.	For Outer Layer	Min track width	0.10
		For Outer Layer	Min. Spacing	0.10
		For Inner Layer	Min track width	0.125
		For Inner Layer	Min. Spacing	0.125
	For Start copper thickness of 1.0 Oz.		Min track width	0.15
			Min. Spacing	0.15
	For Start copper thickness of 2.0 Oz.		Min track width	0.175
			Min. Spacing	0.20

Sr	Specification		Value
a)	Min. finished via hole size		0.10
b)	Min. finished via pad size		0.45
c)	Min. annular ring		0.10
d)	Drill to drill clearance		0.15
e)	Min. slot size for PTH slots (Tool size)		0.50
f)	Blind & Buried vias manufacturable		YES
g)	Drill to track clearance for Inner layers (upto 6 layer)		0.25
	Drill to track clearance for Inner layers (>6 layer)		0.35
h)	Min. drill size for plated holes on board edge		0.80
i)	Min. drill to drill clearance for plated holes on board edge		0.80

Sr	Specification		Value
a)	HASL (Lead free & PB/Sn both)		YES
b)	Electrolytic Gold		YES
c)	Electroless Nickle / Gold		YES
d)	Immersion Silver		YES
e)	Immersion Tin		YES
f)	SMOBC with OSP		YES

Sr	Specification		Value
a)	Min. core thickness		0.15 mm
b)	Min. possible dielectric thickness		0.15 mm
c)	Controlled Impedance merasurement		YES

Sr	Specification		Value
a)	Mask opening	Green masking	0.06 mm
b)	Min. soldermask web width between pads		0.08 mm
c)	Mask opening	Other than Green	0.120 mm
d)	Min. soldermask web width between pads		0.120 mm
e)	SM to trace clearance		0.10 mm
f)	Via fill max drill size		0.40 mm

Sr	Specification		Value
a)	Legend line width		0.15 mm to 0.20 mm
b)	Min. character height		1.00 mm

Sr	Specification		Value
a)	Angle for v-cut		30 degree
b)	Jump scoring		Yes

Sr	Specification		Value
a)	Min. router size		0.80 mm

Sr	Specification		Value
a)	For routing		0.25 mm
b)	For scoring		0.45 mm
c)	For inner layer		0.4 mm

Sr	Specification		Value
a)	Min. line width		0.30 mm
b)	Min. carbon – carbon spacing		0.25 mm

Sr	Specification		Value
a)	Minimum width of any Peel-off element		0.50 mm
b)	Maximum coverable hole ENDSIZE		6.00 mm
c)	Minimum overlap on copper pattern		0.254 mm
d)	Minimum clearance to free copper		0.254 mm
e)	Minimum distance from PCB outline		0.50 mm

PTH Hole Size	PTH Tolerance	NPTH Hole Size	NPTH Tolerance
0.50-3.50 mm	+/- 0.10 mm	<3 mm	+/- 0.10 mm
>3.50 mm	+/- 0.15mm	>3 mm	+/- 0.15 mm

PCB Size	+/- 0.20 mm
PCB Thickness	+/- 20% (Up to 0.8 mm thickness) +/- 10% (Above 1.0 mm thickness)
Trace Width / Spacing	+/- 0.20 %
Copper Thickness Inside Hole	>= 0.20 um
Bow & twist tolerance	+/- 1%

ROHS Compliances finishes :

Lead Free HAL
Immersion Tin
Electroless Nickel Immerssion Gold (0.075-0.1 um AU + 3-5 um Ni)
OSP

Non-ROHS Finish :

HAL(sn PB)

White
Black
Yellow

Green
Black
White
Blue
Red

Impedance Control
Blind / Buried Vias
Carbon Printing
Hard Gold Tabs
Peelable Sodler Mask