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Technical Capabilities

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Technical Capabilities

a)Max. no. of layers 24
b)Max. board size (L x W) in mm.415 x 565
c)Max. board thickness (in mm.) 3.20 mm
d)Min. finished board thickness (in mm.)0.40 mm (No HAL)

Base Material

a)Base MaterialFR4
b)Inner layer Copper cladding
* Max. Cu Wt. For Planes (Oz.) 2
* Max. Cu Wt. For Signals (Oz.) 2
* Min. Cu Wt. (Oz.) 0.5
c)Outer layer Copper cladding
*Max Cu Wt. (Oz.) 3
*Min Cu Wt. (Oz.) 0.5

Circuit Layers (Minimum capabilities in mm)

SrSpecification Value
For Start copper thickness of 0.5 Oz.For Outer LayerMin track width0.10
For Outer LayerMin. Spacing0.10
For Inner LayerMin track width0.125 mm
For Inner LayerMin. Spacing0.125 mm
For Start copper thickness of 1.0 Oz.Min track width0.15
Min. Spacing0.15
For Start copper thickness of 2.0 Oz.Min track width0.175
Min. Spacing0.20


a)Min. finished via hole size0.10 mm
b)Min. finished via pad size 0.45 mm
c)Min. annular ring 0.10 mm
d)Drill to drill clearance 0.15 mm
e)Min. slot size for PTH slots (Tool size) 0.50 mm
f)Blind & Buried vias manufacturable YES
g)Drill to track clearance for Inner layers (upto 6 layer)0.25 mm
Drill to track clearance for Inner layers (>6 layer) 0.35 mm
h)Min. drill size for plated holes on board edge 0.80 mm
i)Min. drill to drill clearance for plated holes on board edge 0.80 mm
j)Any special angle for Counter sunk Not Possible

Surface Finish

a)HASL (Lead free & PB/Sn both) YES
b)Electrolytic Gold YES
c)Electroless Nickle / Gold YES
d)Immersion Silver YES
e)Immersion Tin YES
g)Selective Gold Not Possible

Layer construction & Impedance Design

a)Min. core thickness 0.15 mm
b)Min. possible dielectric thickness 0.15 mm
c)Sequential buildup Not Possible
d)Controlled Impedance merasurement YES

Solder Mask

a)Mask openingGreen masking0.06 mm
b)Min. soldermask web width between pads0.08 mm
c)Mask openingOther than Green0.120 mm
d)Min. soldermask web width between pads0.120 mm
e)SM to trace clearance 0.10 mm
f)Via fill max drill size 0.40 mm


a)Legend line width 0.15 mm to 0.20 mm
b)Min. character height 1.00 mm


a)Angle for v-cut 30 degree
b)Jump scoring Yes


a)Min. router size 0.80 mm
b)Depth routingNot possible
c)Any special tolerances for Chamfering Not possible

Copper Clearance from PCB Edge

a)For routing 0.25 mm
b)For scoring 0.45 mm
c)For inner layer 0.4 mm


a)Min. line width0.30 mm
b)Min. carbon – carbon spacing0.25 mm


a)Minimum width of any Peel-off element 0.50 mm
b)Maximum coverable hole ENDSIZE 6.00 mm
c)Minimum overlap on copper pattern 0.254 mm
d)Minimum clearance to free copper 0.254 mm
e)Minimum distance from PCB outline 0.50 mm

Drill Tolerances

PTH Hole SizePTH ToleranceNPTH Hole SizeNPTH Tolerance
0.50-3.50 mm+/- 0.10 mm<3 mm+/- 0.10 mm
>3.50 mm+/- 0.15mm>3 mm+/- 0.15 mm

Other Tolerances

PCB Size+/- 0.20 mm
PCB Thickness+/- 20% (Up to 0.8 mm thickness)
+/- 10% (Above 1.0 mm thickness)
Trace Width / Spacing+/- 0.20 %
Copper Thickness Inside Hole >= 0.20 um
Bow & twist tolerance+/- 1%

Availabale Finishes

ROHS Compliances finishes :

  • Lead Free HAL
  • Immersion Tin
  • Electroless Nickel Immerssion Gold (0.075-0.1 um AU + 3-5 um Ni)
  • OSP

Non-ROHS Finish :

  • HAL(sn PB)

Legend Colours

  • White
  • Black
  • Yellow

Solder Mask Colours

  • Green
  • Black
  • White
  • Blue
  • Red

Special Technologies

  • Impedance Control
  • Blind / Buried Vias
  • Carbon Printing
  • Hard Gold Tabs
  • Peelable Sodler Mask
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