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Case Study: Resolving PTH Fitment & Stencil Challenges for an Industrial Electronics OEM

Wednesday, 03 June 2026
PCB Power

How PCB Power's engineering intervention eliminated a component-PCB incompatibility and upgraded the printed circuit board assembly process for long-term quality gains.

Customer Snapshot

Customer Type
OEM from the Industrial Electronics Industry
ApplicationIndustrial control/automation electronics
TechnologyPTH (Plated Through-Hole) + SMT Mixed Assembly
Services AvailedPCB Fabrication, PCB Assembly, PCB Stencil


The Assembly Challenge Faced by an Industrial Electronics OEM

The customer submitted PCB design for Turnkey PCB assembly where a fitment incompatibility was identified between the PTH component lead diameters and the drilled hole sizes on the PCB — specifically at reference designators SC1, SC2, SC3, SC4, and several others.

The mismatch meant that standard component insertion was not feasible without risk of damage or poor solder joint integrity. Additionally, the existing PCB stencil design did not account for solder paste application on the PTH pads, which would have necessitated manual soldering a process prone to inconsistency and harder to control at scale.

Two compounding problems had to be solved simultaneously:

  • Mechanical fitment of the component into an incompatible hole
  • Soldering process reliability for PTH parts on a mixed-technology printed circuit board assembly

Technical Solution for the Industrial Electronics OEM Assembly Requirement

PCB Power's engineering team proactively reviewed the design-for-manufacturability (DFM) rules and implemented a design-level fix — not just a one-time workaround. The PCB stencil modification and hole adjustment were logged for future printed circuit board assembly runs, ensuring continuity and consistency across repeat orders.

Our engineering and production team reviewed the assembly data and took a two-step approach:

  • Hole Modification & Component Fitment Despite the incompatibility being outside standard PCB assembly scope, we manually assembled the components and modified the hole dimensions. This was documented and incorporated into the job specification so that future orders would not face the same issue — eliminating repeat escalations.

  • PCB Stencil-Based Solder Paste Process for PTH Parts Rather than defaulting to manual soldering, the engineering team designed specific solder paste apertures on the PCB stencil for the PTH pads. This allowed the PTH components to be processed through the reflow oven alongside SMT components, resulting in:  
    • Consistent and repeatable solder joints
    • Better solder fillet formation
    • Improved barrel fill from both top and bottom sides of the board
    • Elimination of manual soldering variability