Rigid PCB Technical Capabilities
Technical Capabilities (All values are in mm)
| Specification | Value |
|---|---|
| Maximum no. of Layers | 24 |
| Maximum Board Thickness | 3.20 |
| Minimum Finished Board Thickness | 0.20 (No HAL / Masking) |
Maximum Board Size(L x W)
| Material | Value |
|---|---|
| FR4 |
430 x 585 (For SS & DS) 420 x 570 (For Multi layers) |
| Roger | 435 x 275 |
| Itera | 430 x 585 |
| MCPCB | 430 x 585 |
Base Materials
| Specification | Value |
|---|---|
| Base Material | FR4 |
| Inner Layer Copper Cladding | |
| * Max. Cu Wt. For Planes (Oz.) | 2 |
| * Max. Cu Wt. For Signals (Oz.) | 2 |
| * Min. Cu Wt. (Oz.) | 0.5 |
| Outer Layer Copper Clading | |
| * Max Cu Wt. (Oz.) | 3 |
| * Min Cu Wt. (Oz.) | 0.5 |
Circuit Layers (All values are in mm)
| Specification | Value | ||
|---|---|---|---|
| For Start Copper Thickness of 0.5 Oz. | |||
| For Outer Layer | Minimum Track Width | 0.09 | |
| For Outer Layer | Minimum Spacing | 0.09 | |
| For Inner Layer | Minimum Track Width | 0.125 | |
| For Inner Layer | Minimum Spacing | 0.125 | |
| For Start Copper Thickness of 1.0 Oz. | |||
| Minimum Track Width | 0.15 | ||
| Minimum Spacing | 0.15 | ||
| For Start Copper Thickness of 2.0 Oz. | |||
| Minimum Track Width | 0.175 | ||
| Minimum Spacing | 0.20 | ||
Drilling (All values are in mm)
| Specification | Value |
|---|---|
| Minimum Finished via Hole Size | 0.10 |
| Minimum via Pad Size | |
| Outer Layers | 0.40 |
| Inner Layers | 0.45 |
| Minimum Annular Ring | 0.10 |
| Drill to Drill Clearance | 0.15 |
| Minimum Slot Size For PTH Slots (Tool size) | 0.50 |
| Blind & Buried vias Manufacturable | Yes |
| Drill to Track Clearance For Inner Layers (upto 6 layer) | 0.20 |
| Drill to Track Clearance for Inner Layers (>6 layer) | 0.25 |
| Minimum Drill Size For Plated Holes on Board Edge | 0.60 |
| Minimum Drill to Drill Clearance For Plated Holes on Board Edge | 0.20 |
Surface Finish
| Specification | Value |
|---|---|
| HASL (Lead free & PB/Sn both) | Yes |
| Electrolytic Gold | Yes |
| Electroless Nickle / Gold | Yes |
| Immersion Tin | Yes |
Layer construction Impedance Design (All values are in mm)
| Specification | Value |
|---|---|
| Minimum Core Thickness | 0.10 |
| Minimum Possible Dielectric Thickness | 0.10 |
| Controlled Impedance Measurement | Yes |
Solder Mask (All values are in mm)
| Specification | Value |
|---|---|
| Mask Opening | |
| Green & Blue Masking | 0.06 |
| Minimum Soldermask Web Width Between Pads | 0.08 |
| Mask Opening | |
| Other than Green & Blue Masking | 0.10 |
| Minimum Soldermask Web Width Between Pads | 0.120 |
| SM to Trace Clearance | 0.10 |
| Via Fill Maximum Drill Size | 0.35 |
Legend (All values are in mm)
| Specification | Value |
|---|---|
| Legend Line Width | 0.10 |
| Minimum Character Height | 1.00 |
Scoring
| Specification | Value |
|---|---|
| Angle For v-cut | 30 degree |
| Jump Scoring | Yes |
Routing (All values are in mm)
| Specification | Value |
|---|---|
| Minimum Router Size | 0.50 |
Copper Clearance from PCB Edge (All values are in mm)
| Specification | Value |
|---|---|
| For Routing | |
| For Inner Layer | 0.25 |
| For Outer Layer | 0.20 |
| For Scoring | |
| For Inner Layer | 0.45 |
| For Outer Layer | 0.40 |
Carbon (All values are in mm)
| Specification | Value |
|---|---|
| Minimum Line Width | 0.30 |
| Minimum Carbon – Carbon Spacing | 0.25 |
Peelable (All values are in mm)
| Specification | Value |
|---|---|
| Minimum Width of Any Peel-off Element | 0.50 |
| Maximum Coverable Hole ENDSIZE | 6.00 |
| Minimum Overlap on Copper Pattern | 0.254 |
| Minimum Clearance to Free Copper | 0.254 |
| Minimum Distance From PCB Outline | 0.50 |
Drill Tolerances (All values are in mm)
| PTH Hole Size | PTH Tolerance | NPTH Hole Size | NPTH Tolerance |
|---|---|---|---|
| 0.50-3.50 | +/- 0.10 | 0.50-3.50 | +/- 0.10 |
| >3.50 | +/- 0.15 | >3.50 | +/- 0.15 |
Other Tolerances
| PCB Size | PCB Thickness | Trace Width / Spacing | Copper Thickness Inside Hole | Bow & twist tolerance |
|---|---|---|---|---|
| +/- 0.20 mm | +/- 20% (Up to 0.8 mm thickness) | +/- 20 % | >= 0.020 | +/- 1% |
| +/- 10% (Above 1.0 mm thickness) |
Available Finishes
| RoHS Compliances finishes | Non-RoHS Finish |
|---|---|
| Lead Free HAL | HAL(sn PB) |
| Immersion Tin | - |
| Electroless Nickel Immerssion Gold (0.075-0.1 um AU + 3-5 um Ni) | - |
Legend Colours
| Color | Value |
|---|---|
| White | Yes |
| Black | Yes |
| Yellow | Yes |
Solder Mask Colours
| Color | Value |
|---|---|
| Green | Yes |
| Black | Yes |
| White | Yes |
| Blue | Yes |
| Red | Yes |
| Purple | Yes |
| Yellow | Yes |
| Orange | Yes |
Technologies
| Specification | Value |
|---|---|
| Impedance Control | Yes |
| Blind / Buried Vias | Yes |
| Carbon Printing | Yes |
| Hard Gold Tabs | Yes |
| Peelable Solder Mask | Yes |
