Technical Capabilities PCB-A

PCB A - Technical Capabilities

Supported PCB Assembly Variants

  • Surface Mount technology (SMT)
  • Through-hole technology (THT)
  • Mixed Technology (SMT / Through hole)
  • Single or double-sided placement

Types of Solder paste for Assembly

  • Leaded
  • Lead-free (RoHS Compliant)

PCB Stencils Type

  • Framed stencil
  • Frameless stencil

Minimum Order

We do not have any minimum order quantity constraints.

Types of Components

  • Passive Components, as small as 01005, 0201, 0402
  • Fine Pitch Parts (QFN, QFP)
  • Small Chip Packages, SOIC, PLCC, TSOP, BGA
  • THT, CSP, CCGA, DPAK, Alcap, Tantalum
  • Maximum Size: 56 X 56 X 15 mm

Via on Solder Pad

The solder pad vias are available based on the compatibility of the requirement with the design. Since the solder passes through the via, it is not prominently visible. If this is acceptable to your design standards our team can work on the solder pad vias.

However, the functionality is not available for BGA.

Minimum Pad Size for BGA

0.20 mm

BGA/QFN pad edge to edge clearance conditions for feasibility

The following conditions must be met in order to make edge-to-edge clearance viable:

1. Clearance > 0.17 mm (without a dam)

2. Clearance is between 0.15 mm and 0.17 mm (viable only with a dam)

3. Clearance < 0.15 mm is not feasible or recommended

Component Package Format that we accept

  • Reels
  • Cut Tape (Please note: The cut tape must be continuous and a minimum of 12 inches long.)
  • Tube & Tray
  • Loose Parts

Clearance from the Board’s Edge to the Component

3.00 mm (Less than 3.00 mm is acceptable for less than 6 pads towards edge and only for passive components)

PCB Board Shapes

We can assemble boards in Rectangular, Circular and any other Unusual shapes (for shapes other than rectangle, the boards must be panelized in an array, and a panel border needs to be added at the two longer paralleled edges of the panelized boards to ensure that the boards can be assembled by the machine)

PCB Materials

For Rigid PCBs, our offerings are FR4,Rogers and MCPCB.

For Flexible PCBs please connect with our technical sales support team at for availability and feasibility.

Quality Inspection

We conduct inspection using:

  • Visual Examination Processes
  • X-Ray
  • Automated Optical Inspection

Supported File Formats

  • BOM: .xls, .csv, .xlsx
  • Gerber (RS-274X)
  • Centroid (XY, Pick-n-Place)

Board Dimensions

PCB Thickness Minimum 0.40 mm , Maximum: 3.2 mm
For Standard Components Maximum size: 420.00 mm x 420.00 mm ( Stencil size should not be larger than 290 mm)
Minimum size: 50.00 mm on any side
For Component Pitch <= 0.50 mm (BGA/QFN) Maximum size: 200.00 mm x 200.00 mm(Solder dam is preferable)
PCB Board thickness: (1.00 mm - 3.2 mm) Maximum size: 420.00 mm x 420.00 mm
PCB Board thickness: (0.40 mm - 1.00 mm) Maximum size: 200.00 mm x 200.00 mm
PCB Board thickness < 0.40 mm Not Feasible with us.
docx file PDF