It is very important that an ideal surface finish be selected for a PCB. The high assembly density and Ball Grid Array (BGA) have led to the higher usage of electronic packages for commercial applications. Besides the Hot Air Solder Level (HASL / HAL), there are many other surface finishes too to fulfill the advanced assembly needs. With each finish having its individual benefits and limitations, the ideal choice on a product’s application.
Major decision drivers for Ideal Surface finish: