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Technical Capabilities

SR SPECIFICATION VALUE
a) Max. no. of layers 24
b) Max. board size (L x W) in mm. 430 x 585 (For SS & DS)
415 x 565 (For Multi layers)
c) Max. board thickness (in mm.) 3.20
d) Min. finished board thickness (in mm.) 0.20 (No HAL / Masking)

Base materials

SR SPECIFICATION VALUE
a) Base material FR4
b) Inner Layer Copper Cladding
 * Max. Cu Wt. For Planes (Oz.) 2
 * Max. Cu Wt. For Signals (Oz.) 2
 * Min. Cu Wt. (Oz.) 0.5
c) Outer Layer Copper Clading
 *Max Cu Wt. (Oz.) 3
 *Min Cu Wt. (Oz.) 0.5

Circuit Layers (Minimum capabilities in mm)

SR SPECIFICATION   VALUE
a) For Start copper thickness of 0.5 Oz. For Outer Layer Min track width 0.09
For Outer Layer Min. Spacing 0.09
For Inner Layer Min track width 0.10
For Inner Layer Min. Spacing 0.10
b) For Start copper thickness of 1.0 Oz. Min track width 0.125
Min. Spacing 0.125
c) For Start copper thickness of 2.0 Oz. Min track width 0.20
Min. Spacing 0.20

Drilling (All Values are in mm)

SR SPECIFICATION VALUE
a) Min. finished via hole size 0.10
Minimum via tool size 0.20
b) Min. finished via pad size 0.45
c) Min. annular ring (for outer layers with tool size) 0.10
Min. annular ring (for inner layers with tool size) 0.125
d) Drill to drill clearance (with finished drills) 0.25
Drill to drill clearance (with tool size) 0.15
e) Min. slot size for PTH slots (Tool size) 0.50
f) Blind & Buried vias manufacturable YES
g) Drill to track clearance for Inner layers with tool size (upto 6 layer) 0.25
Drill to track clearance for Inner layers with tool size (>6 layer) 0.35
h) Min. drill size for plated holes on board edge 0.60
i) Min. Pad to Pad clearance for plated holes on board edge 0.20

Surface Finish

SR SPECIFICATION VALUE
a) HASL (Lead free & PB/Sn both) YES
b) Electrolytic Gold YES
c) Electroless Nickle / Gold YES
d) Immersion Silver NO
e) Immersion Tin YES
f) SMOBC with OSP NO

Layer construction Impedance Design

SR SPECIFICATION VALUE
a) Min. core thickness 0.10 mm
b) Min. possible dielectric thickness 0.10 mm
c) Controlled Impedance merasurement YES

Solder Mask

SR SPECIFICATION VALUE
a) Mask opening Green & Blue Masking 0.06 mm
b) Min. soldermask web width between pads 0.08 mm
c) Mask opening Other than Green & Blue 0.120 mm
d) Min. soldermask web width between pads 0.120 mm
e) SM to trace clearance 0.10 mm
f) Via fill max drill size 0.40 mm

Legend

SR SPECIFICATION VALUE
a) Legend line width 0.10 mm
b) Min. character height 1.00 mm

Scoring

SR SPECIFICATION VALUE
a) Angle for v-cut 30 degree
b) Jump scoring Yes

Routing

SR SPECIFICATION VALUE
a) Min. router size 0.50 mm

Copper Clearance from PCB Edge

SR SPECIFICATION VALUE
a) For routing 0.20 mm for outer layer / 0.40 mm for inner layer
b) For scoring 0.20 mm for outer layer / 0.40 mm for inner layer

Carbon

SR SPECIFICATION VALUE
a) Min. line width 0.30 mm
b) Min. carbon – carbon spacing 0.25 mm

Peelable

SR SPECIFICATION VALUE
a) Minimum width of any Peel-off element 0.50 mm
b) Maximum coverable hole ENDSIZE 6.00 mm
c) Minimum overlap on copper pattern 0.254 mm
d) Minimum clearance to free copper 0.254 mm
e) Minimum distance from PCB outline 0.50 mm

Drill Tolerances

PTH HOLE SIZE PTH TOLERANCE NPTH HOLE SIZE NPTH TOLERANCE
0.50-3.50 mm +/- 0.10 mm <3 mm +/- 0.10 mm
>3.50 mm +/- 0.15mm >3 mm +/- 0.15 mm

Other Tolerances

PCB Size +/- 0.20 mm
PCB Thickness +/- 20% (Up to 0.8 mm thickness)
+/- 10% (Above 1.0 mm thickness)
Trace Width / Spacing +/- 0.20 %
Copper Thickness Inside Hole >= 0.20 um
Bow & twist tolerance +/- 1%



Availabale Finishes

ROHS Compliances finishes :

  • Lead Free HAL
  • Immersion Tin
  • Electroless Nickel Immerssion Gold (0.075-0.1 um AU + 3-5 um Ni)

Non-ROHS Finish :

  • HAL(sn PB)

Legend Colours

  • White
  • Black

Solder Mask Colours

  • Green
  • Black
  • White
  • Blue
  • Red

Special Technologies

  • Impedance Control
  • Blind / Buried Vias
  • Carbon Printing
  • Hard Gold Tabs
  • Peelable Solder Mask